Koch Chemie Micro Cut M2.02 - Anti-Hologram Polishing Compound 1L

Micro-particle abrasive compound without silicone oil

The anti-hologram high-gloss compound Micro Cut M3.02 is a micro-particle compound for machine polishing of the latest generation for permanent removal of polishing marks; holograms; fine scratches up to a grit size of 4,000 for all types of paint (including scratch-resistant). Thanks to the use of highly specialized and extremely homogeneous abrasive bodies, a brilliant and durable high-gloss surface finish is achieved even on dark and similarly sensitive color shades under extreme lighting conditions. Holograms and fine scratches are mechanically removed. The anti-hologram high-gloss compound Micro Cut M3.02 is particularly economical; it polishes well and can be removed without residue.

Area of application :

To achieve optimal results, we recommend using our Micro Cut Pad and a forced-rotation dual-action polisher (e.g., Makita PO5000C; highest speed). Alternatively, you can use a rotary polisher in combination with our Micro Cut Pad. Spread the compound evenly with the machine turned off onto the surface to be treated and then polish with light pressure in a cross-hatch pattern; until a transparent film forms; that is; until the aluminum oxide contained in the compound completely breaks down. Do not use pads used for this product with other products. For scratch- and swirl-free removal of compound residue, we recommend our professional ultrasonic-cut microfiber towel.

Warning:

Shake well before use. Check suitability and compatibility before use. Do not use on hot surfaces. Protect from frost and excessive heat.